HiNC-Deploy/HiNC-2025-win-desktop-Deploy
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iamboss
2025-07-18 15:38:28 +08:00
parent aabaf90482
commit 38b27cd481
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App/Resource/WorkpieceMaterial/S45C.WorkpieceMaterial
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<WorkpieceMaterial>
<Name>S45C</Name>
<ElasticModulus_GPa>190</ElasticModulus_GPa>
<CompressiveYieldStrength_MPa>450</CompressiveYieldStrength_MPa>
<TensileYieldStrength_MPa>490</TensileYieldStrength_MPa>
<ElogationRaioAtBreak>0.17</ElogationRaioAtBreak>
<HeatCapacity_JdgK>0.4326</HeatCapacity_JdgK>
<HeatConductivity_WdmK>49.8</HeatConductivity_WdmK>
<Density_gdcm3>7.7</Density_gdcm3>
<FusionLatentHeat_Jdg>270</FusionLatentHeat_Jdg>
<MeltingTemperature_C>1440</MeltingTemperature_C>
<PoissonRatio>0.28</PoissonRatio>
</WorkpieceMaterial>