HiNC-Deploy/HiNC-2025-win-desktop-Deploy
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iamboss
2025-07-18 15:38:28 +08:00
parent aabaf90482
commit 38b27cd481
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App/Resource/WorkpieceMaterial/AA7075.WorkpieceMaterial
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<WorkpieceMaterial>
<Name>AA7075</Name>
<Note>AA7075</Note>
<ElasticModulus_GPa>71.7</ElasticModulus_GPa>
<PoissonRatio>0.33</PoissonRatio>
<CompressiveYieldStrength_MPa>480</CompressiveYieldStrength_MPa>
<TensileYieldStrength_MPa>503</TensileYieldStrength_MPa>
<ElogationRaioAtBreak>0.11</ElogationRaioAtBreak>
<HeatCapacity_JdgK>0.875</HeatCapacity_JdgK>
<HeatConductivity_WdmK>130</HeatConductivity_WdmK>
<Density_gdcm3>2.81</Density_gdcm3>
<FusionLatentHeat_Jdg>390</FusionLatentHeat_Jdg>
<MeltingTemperature_C>635</MeltingTemperature_C>
</WorkpieceMaterial>