HiNC-Deploy/Demo-Para-Training-S50C-202501
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data: record the dt-side S50C training state

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Seven new .mp fits from the fine/test sweeps (0.0001 .. 0.3), the S50C
workpiece material and CuttingParameter side-files they reference, the
schema-migrated S50C.hincproj, and the test-err-ratio project. These were
produced by runs on HiNC-1 and existed only in dt's working tree.

Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
This commit is contained in:
iamboss
2026-08-07 15:21:34 +08:00
co-authored by Claude Opus 5
parent c79894de58
commit fe55e87597
16 changed files with 1069 additions and 97 deletions
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WorkpieceMaterial/FC30.WorkpieceMaterial
+1 -1
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@@ -8,7 +8,7 @@
<TensileYieldStrength_MPa>200</TensileYieldStrength_MPa>
<ElogationRaioAtBreak>0.01</ElogationRaioAtBreak>
<HeatCapacity_JdgK>0.46</HeatCapacity_JdgK>
<HeatTransferCoefficient_WdmK>52</HeatTransferCoefficient_WdmK>
<HeatConductivity_WdmK>52</HeatConductivity_WdmK>
<Density_gdcm3>7.2</Density_gdcm3>
<FusionLatentHeat_Jdg>220</FusionLatentHeat_Jdg>
<MeltingTemperature_C>1150</MeltingTemperature_C>
WorkpieceMaterial/S50C.WorkpieceMaterial
+15
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@@ -0,0 +1,15 @@
<?xml version="1.0" encoding="utf-8"?>
<WorkpieceMaterial>
<Name>S50C</Name>
<Note></Note>
<ElasticModulus_GPa>205</ElasticModulus_GPa>
<PoissonRatio>0.28</PoissonRatio>
<CompressiveYieldStrength_MPa>580</CompressiveYieldStrength_MPa>
<TensileYieldStrength_MPa>540</TensileYieldStrength_MPa>
<ElogationRaioAtBreak>0.16</ElogationRaioAtBreak>
<HeatCapacity_JdgK>0.49</HeatCapacity_JdgK>
<HeatConductivity_WdmK>50</HeatConductivity_WdmK>
<Density_gdcm3>7.85</Density_gdcm3>
<FusionLatentHeat_Jdg>270</FusionLatentHeat_Jdg>
<MeltingTemperature_C>1495</MeltingTemperature_C>
</WorkpieceMaterial>